• JEDEC JEP123

JEDEC JEP123

  • GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS
  • standard by JEDEC Solid State Technology Association, 10/01/1995
  • Category: JEDEC

$62.00 $31.00

The need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD230C

JEDEC JESD230C

NAND Flash Interface Interoperability..

$46.00 $91.00

JEDEC JESD47I.01

JEDEC JESD47I.01

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS..

$36.00 $72.00

JEDEC JESD217.01

JEDEC JESD217.01

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES..

$44.00 $87.00

JEDEC JESD31E

JEDEC JESD31E

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES..

$37.00 $74.00