JEDEC JESD22-B109B
- FLIP CHIP TENSILE PULL
- standard by JEDEC Solid State Technology Association, 07/01/2014
- Category: JEDEC
$56.00
$28.00
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.
PDF
All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.
Multi-User Access
After purchasing, you have the ability to assign each license to a specific user.
Printable
At any time, you are permitted to make printed copies for your and your members' reference use.
