• JEDEC JEP131B

JEDEC JEP131B

  • Potential Failure Mode and Effects Analysis (FMEA)
  • standard by JEDEC Solid State Technology Association, 04/01/2012
  • Category: JEDEC

$67.00 $34.00

This publication applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should include, but are not limited to: package design, chip design, process development, assembly, fabrication, manufacturing, materials, quality, service, and suppliers, as well as the process requirements needed for the next assembly.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD201A

JEDEC JESD201A

ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FI..

$37.00 $74.00

JEDEC JESD15-4

JEDEC JESD15-4

DELPHI COMPACT THERMAL MODEL GUIDELINE..

$34.00 $67.00

JEDEC JESD15

JEDEC JESD15

THERMAL MODELING OVERVIEW..

$26.00 $51.00

JEDEC JESD15-1

JEDEC JESD15-1

COMPACT THERMAL MODEL OVERVIEW..

$28.00 $56.00