JEDEC STANDARDS PDF

JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.

JEDEC JESD51-50

This document provides an overview of the methodology necessary for making meaningful thermal measur..

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JEDEC JESD51-51

The purpose of this document is to specify, how LEDs's thermal metrics and other thermally-related d..

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JEDEC JESD51-52

This document is intended to be used in conjunction with the JESD51-50 series of standards, especial..

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JEDEC JESD51-6

This standard specifies the environmental conditions for determining thermal performance of an integ..

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JEDEC JESD51-7

This fixturing further defines the environment for thermal test of packaged microelectronic devices...

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JEDEC JESD51-8

This specification should be used in conjunction with the overview document JESD51, Methodology for ..

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JEDEC JESD51-9

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterizatio..

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JEDEC JESD52

This standard describes dc interface specifications and test environment for these devices that oper..

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JEDEC JESD531 (R2002)

This standard describes a test method for measuring the thermal resistance of signal and regulator d..

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JEDEC JESD54

The purpose is to provide a standard of BiCMOS Logic series specifications to provide for uniformity..

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JEDEC JESD55

The purpose is to provide a standard of BiCMOS Logic series specifications for uniformity, multiplic..

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JEDEC JESD557C

This standard specifies the general requirements of a statistical process control (SPC) system. Cont..

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JEDEC JESD57

This test method defines requirements and procedures for ground simulation and single event effects ..

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JEDEC JESD59

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package..

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JEDEC JESD6 (R2002)

This standard gives a test method for measuring transistor capacitance using a three-terminal bridge..

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JEDEC JESD60A

This method establishes a standard procedure for accelerated testing of the hot-carrier-induced chan..

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