• JEDEC JESD22-A104E

JEDEC JESD22-A104E

  • TEMPERATURE CYCLING
  • standard by JEDEC Solid State Technology Association, 10/01/2014
  • Category: JEDEC

$59.00 $30.00

This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD 22-B115

JEDEC JESD 22-B115

SOLDER BALL PULL..

$31.00 $62.00

JEDEC JESD84-B41

JEDEC JESD84-B41

MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, STANDARD CAPACITY (MMCA, 4.1)..

$104.00 $208.00

JEDEC JESD84-A42

JEDEC JESD84-A42

EMBEDDED MULTIMEDIACARD (e*MMC) PRODUCT STANDARD, HIGH CAPACITY..

$37.00 $74.00

JEDEC JESD84-B42

JEDEC JESD84-B42

MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, HIGH CAPACITY (MMCA, 4.2)..

$104.00 $208.00