• JEDEC JESD22-A108F

JEDEC JESD22-A108F

  • TEMPERATURE, BIAS, AND OPERATING LIFE
  • standard by JEDEC Solid State Technology Association, 07/01/2017
  • Category: JEDEC

$54.00 $27.00

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices? operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD22-B113B

JEDEC JESD22-B113B

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HAN..

$34.00 $67.00

JEDEC JEP131C

JEDEC JEP131C

Potential Failure Mode and Effects Analysis (FMEA)..

$36.00 $72.00

JEDEC JESD22-A117D

JEDEC JESD22-A117D

ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST..

$34.00 $67.00

JEDEC JESD251

JEDEC JESD251

EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NON VOLATILE MEMORY DEVICES, VERSION 1.0..

$58.00 $116.00