JEDEC JESD217
- TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
- standard by JEDEC Solid State Technology Association, 09/01/2010
- Category: JEDEC
$80.00
$40.00
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
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