• JEDEC J-STD-033C

JEDEC J-STD-033C

  • JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
  • standard by JEDEC Solid State Technology Association, 12/01/2011
  • Category: JEDEC

$74.00 $37.00

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damagefrom the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlifeexposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary toavoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedureand JEP113 defines the labeling requirements.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD82-15

JEDEC JESD82-15

STANDARD FOR DEFINITION OF CUA878 PLL CLOCK DRIVER FOR REGISTERED DDR2 DIMM APPLICATIONS..

$31.00 $62.00

JEDEC JESD203

JEDEC JESD203

STANDARD TEST LOADS FOR DUAL-SUPPLY LEVEL TRANSLATION DEVICES..

$26.00 $51.00

JEDEC EIA 557B

JEDEC EIA 557B

STATISTICAL PROCESS CONTROL SYSTEMS..

$37.00 $74.00

JEDEC JEP130A

JEDEC JEP130A

GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING..

$27.00 $54.00