JEDEC J-STD-033B.1
- JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
- standard by JEDEC Solid State Technology Association, 01/01/2007
- Category: JEDEC
$67.00
$34.00
NOTE - The Moisture Sensitive Caution Label (figure 3-4) has been editorially revised since originally posted 11/04/05, if you downloaded this file prior to 12/14/05 please download this revised version. This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. IPC/JEDEC J-STD-033B helps achieve safe and damage-free reflow with the dry packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.
PDF
All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.
Multi-User Access
After purchasing, you have the ability to assign each license to a specific user.
Printable
At any time, you are permitted to make printed copies for your and your members' reference use.